All About Okun News Mag

High Thermally Conductive Solutions

Jun 25

The transfer of thermal energy between objects of different temperatures occurs primarily by conduction and to a lesser extent by radiation. The ability of a material to resist heat flow is determined by its thermal insulating properties. The higher the thermal conductivity of a material, the greater its insulating capability.

The Power of Thermally Conductive Insulators management of electronic devices is a critical factor in the overall success of a product. If a device or component becomes too hot to touch, it may cause injuries and can also lead to negative media coverage and potential legal liabilities for the manufacturer. As such, the design of a product must consider thermal issues from the outset in order to achieve the desired end-user experience and ensure long-term reliability.

Traditional insulation materials range from bulky fibers such as fiberglass, rock and slag wool, cellulose, and natural fibers to rigid foam boards to sleek foils. These materials all provide a layer of insulation to reduce conduction and convective heat transfer in a home or commercial building. Many insulators work by trapping air or another gas in pockets, pores, and voids to obstruct the paths of heat conduction. This includes expanded and extruded polystyrene (popularly referred to as styrofoam) and silica aerogels, as well as natural, biological insulators such as fur and feathers.

In addition to their thermal insulating capabilities, some of these modern insulators also offer electrical insulating properties. This is important for electronic applications where components or products are stacked and connected together within a package. Without an electrical insulator, this could result in a short circuit and possibly an electrical fire hazard.

As the world continues to evolve into a more digital, interconnected society, 3D integrated circuit technologies are becoming increasingly popular as a way to further reduce the size and cost of electronics. However, this trend presents challenges with respect to thermal management. The heat generated by these layers of stacked chips must be dissipated efficiently to avoid the risk of shortening life expectancy or even failure due to elevated temperatures.

To address these challenges, the design and fabrication of new electronic materials has been focused on achieving both excellent electrical properties and good thermal insulating qualities. To improve the electrical performance of these materials, they are often filled with inorganic fillers such as silver, copper, beryllia, and aluminum nitride. The challenge with using these inorganic fillers is that they usually have a relatively high thermal conductivity, which can render the adhesives or tapes they are used on as non-insulative. CMI offers a solution to this problem with its CHO-THERM line of thermally conductive, electrically insulative adhesives and isolation pads. The CHO-THERM line of products features a highly conductive ceramic filler coated on a Polyimide film that provides reliable and high-performance thermal and electrical insulation. Learn more about this exciting new development by downloading the CHO-THERM brochure.


Custom Materials, Inc
16865 Park Circle Drive
Chagrin Falls, Ohio 44023
(440) 543-8284